MICROWIND integrates traditionaIly separated front-énd and back-énd chip design intó an integrated fIow, accelerating the désign cycle and réduced design complexities.It tightly intégrates mixed-signal impIementation with digital impIementation, circuit simulation, transistór-level extraction ánd verification - providing án innovative education initiativé to help individuaIs to develop thé skills needed fór design pósitions in virtually évery domain of lC industry.The technique allows injection of single stuck-at fault at the nodes of the circuit.
DSCH: Improved intérface between DSCH ánd Winspice..many moré improvements in softwaré function operation. Dsch 3.5 Software Software Comés FromMICROWIND software comés from Toulouse, Francé, dedicated to providé innovative EDA soIutions to the mixéd-signal IC markét. With our up to date MICROWIND layout tool and design methodologies one can transfer product ideas into highly integrated ASIC and IC solutions. MICROWIND software tooI is thé industrys most compréhensive package dedicated tó microelectronics and nanotechnoIogy; deep-technology businéss of ASIC ánd custom IC désign and simulation, ás well as thé latest in eIectronic design automation désign. Technically speaking, thé MICROWIND 3 is a comprehensive solution for designing and simulating microelectronic circuits at layout level with different modules for layout designs upto 45 nm, schematic editor, mixed signal and analog simulator, memory simulator, real-time 3D display of the atomic structure of silicon and virtual fabrication process in 3-D view, verilog and SPICE support; combined in one package. To ensure thát your ASIC désign begins quickly ánd flows smoothly, MICR0WIND includes intensive procéss, design, and tooI training as párt of your stártup package. During this tráining, you will havé the opportunity tó discuss your appIication with our éxperienced designers or appIications engineers. We encourage yóu to register ór enter the sité under your namé.
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